Process Chart
R-PCB manufacturing process chart
Product design
- 1PCB DATA manufacturing
- 2Film extrusion
- 3Film inspection
Cutting out
- 1Raw material cutting out
- 2Al-Foil THE
- 3Back-Up
- 4Board cutting out
Inner Layer
- 1Front
- 2Laminator
- 3Exposure
- 4Phenomenon
- 5Corrosion
- 6Delamination
- 7AOI inspection
- 8Oxide treatment
Press
- 1Pre-Preg cutting out
- 2Lay-Up
- 3Hot Press
- 4Cold Press
- 5Target Hole processing
- 6Trimming
- 7Chamfer
Drill
- 1Stack, Tapping
- 2Bit Setting
- 3Drilling
- 4Hole AOI
Plating
- 1Electroless plating
- 2Panel plating
Image
- 1Front
- 2Laminator
- 3Exposure
- 4Phenomenon
- 5Corrosion
- 6Delamination
- 7AOI inspection
- 8Impedance
Solder Mask
- 1Front
- 2PSR printing
- 3Exposure
- 4Phenomenon
- 5Marking
Surface Treatment
- 1HAL (lead plating)
- 2OSP (Flux Coating)
- 3Au(gold) Plating
- 4TIN plating
External processing
- 1Route processing
- 2Press processing
- 3V-CUT
BBT
- 1Jig-free (Fly-Probe Type)
- 2Universal
- 3Dedicate
Final inspection
Shipment Inspection
- 1AFVI (Aotomatic Final Visual Inspection)
- 2Reliability Test
Packaging
Single-sided PCB process chart
Product design
- 1PCB DATA production
- 2Film extrusion
- 3Film inspection
Cutting out
- 1Raw material cutting out
Circuit formation
- 1Front first
- 2P/T printing and drying
- 3Corrosion
- 4Delamination
SR Mask
- 1Front second
- 2S/R printing and drying
Marking
- 1T/M printing and drying
- 2B/M printing and drying
Guide Hole
- 1Press guide hole processing
Press
- 1Part loading hole and external processing
V-cut
- 1PCB separating groove processing
BBT
- 1Electrical properties inspection (Open, Short)
Surface treatment
- 1OSP (Flux Coating)
Final inspection
- 1PCB surface inspection (total inspection)
Shipment inspection
- 1PCB surface inspection
- 2Dimension measurement inspection
- Shipment inspection standards
packaging