Grade Standard
Measurement Management Standards
| Process | Items | Grade C | Grade B | Grade A | Manager |
|---|---|---|---|---|---|
| Inner layer DF | TC | above 0.1T | below 0.1T | 0.05T | K.S.J CJ |
| Line / Space(㎛) | 100 / 100 | 70 / 70 | 50 / 50 | ||
| Capper | 1oz | 1oz | 2oz | ||
| External layer DF | Copper foil thickness(oz) | H | 1 | 2 | H.K.M CJ |
| Minimum circuit line(mm) | 0.15 | 0.15 | 0.2 | ||
| Minimum inter-circuit short gap(mm) | 0.15 | 0.15 | 0.3 | ||
| Lamination | No. of layers(Layer) | – | 4 ~ 6 Layer | above 6 Layer | K.S.J CJ |
| Thickness(T) | – | 1.6 ~ 2.0T | above 1.6T | ||
| Drill | Via Hole / Land Size(㎛) | Min : 400 / 700 | Min : 300 / 600 | Min : 250 / 500 | J.W.W BJ |
| Max : 400 / 800 | Max : 400 / 700 | Max : 300 / 600 | |||
| Copper plating | Standard for thickness in holes(㎛) | 20 ~ 30 | 25 ~ 35 | 30 ~ 40 | S.Y.M CJ |
| Contest standards | Implemented once a week | Implemented twice a week | When a new model is underway | Factory director | |