Grade Standard
Measurement Management Standards
| Process | Items | Unit | Grade | Note | |||
|---|---|---|---|---|---|---|---|
| C | B | A | S | ||||
| Inner Layer | Core thckness | T | – | ＞0.4 | 0.1 ~ 0.4 | 0.05 | . LDI Exposrue . Vacuum etching |
| Line / Space | ㎛ | 100 / 100 | 70 / 70 | 50 / 50 | 50 / 50 | ||
| Copper thickness | – | – | 1/3oz ~ 1oz | 2oz | 3oz | ||
| Mass Lam. | Layer | – | 4 ~ 6 | 8 ~ 12 | 14 ~ 18 | ≥20 | . High Frequency bonding |
| Board thickness | T | – | 0.8 ~ 1.6 | ＞1.6 | ≤3.2 | ||
| Drill | Min. Hole Dia. | Φ | – | 0.40 ~ 0.60 | 0.20 ~ 0.35 | 0.15 | . Mechanical Drill |
| Annular ring (One-sided) | ㎛ | – | ≥120 | 100 | 75 | ||
| Out Layer | Line / Space | ㎛ | 100 / 100 | 70 / 75 | 50 / 55 | 35 / 40 | . LDI Exposrue . Vacuum etching |
| Copper thickness | – | – | 1/3oz ~ 1oz (+Cu plating) |
2oz + Cu plating | 3oz, 4oz (+Cu plating) |
||
| PSR | Dam width | ㎛ | – | ≤100 | 75 | 50 | . DI Exposure |
| SR Opening | ㎛ | – | ＞150 | ≤120 | 100 | ||
| Routing | Routing Accuracy | ㎜ | ±0.2 | ±0.1 | ±0.05 | ||
| Process | Items | Grade C | Grade B | Grade A | Manager |
|---|---|---|---|---|---|
| Inner layer DF | TC | above 0.1T | below 0.1T | 0.05T | K.S.J CJ |
| Line / Space(㎛) | 100 / 100 | 70 / 70 | 50 / 50 | ||
| Capper | 1oz | 1oz | 2oz | ||
| External layer DF | Copper foil thickness(oz) | H | 1 | 2 | H.K.M CJ |
| Minimum circuit line(mm) | 0.15 | 0.15 | 0.2 | ||
| Minimum inter-circuit short gap(mm) | 0.15 | 0.15 | 0.3 | ||
| Lamination | No. of layers(Layer) | – | 4 ~ 6 Layer | above 6 Layer | K.S.J CJ |
| Thickness(T) | – | 1.6 ~ 2.0T | above 1.6T | ||
| Drill | Via Hole / Land Size(㎛) | Min : 400 / 700 | Min : 300 / 600 | Min : 250 / 500 | J.W.W BJ |
| Max : 400 / 800 | Max : 400 / 700 | Max : 300 / 600 | |||
| Copper plating | Standard for thickness in holes(㎛) | 20 ~ 30 | 25 ~ 35 | 30 ~ 40 | S.Y.M CJ |
| Contest standards | Implemented once a week | Implemented twice a week | When a new model is underway | Factory director | |