Certification Status
- O.C.D : 2008.04.24
- Valid From : 2011.03.26
- Valid Until : 2014.03.25
- O.C.D : 2009.07.31
- Valid From : 2011.07.28
- Valid Until : 2014.07.28
- O.C.D : 2021.11.30
- O.C.D : 2010.01.13
- Valid From : 2010.01.16
- Valid Until : 2013.01.15
- O.C.D : 2009.06.10
- O.C.D : 2010.04.15
- Valid From : 2010.04.15
- Valid Until : 2012.04.14
- O.C.D : 2009.03.02
- Valid From : 2009.03.02
- Valid Until : 2012.03.01
- O.C.D : 2000.12.26
- O.C.D : 2005.10.12
- Valid From : 2005.10.12
- Valid Until : 2007.10.11
- O.C.D : 2005.03.01
- Valid From : 2005.03.01
- Valid Until : 2007.02.28
- O.C.D : 2006.12.18
- Valid From : 2006.12.18
- Valid Until : 2009.12.17
- O.C.D : 2005.02.01
- Valid From : 2006.08.01
Patent Status
| Patent Registration Date | Patent Contents | Application number |
|---|---|---|
| 2006. 08 | Manufacturing process of HCCL printed circuit board | Patent No. 10-0610263 |
| 2015. 07 | Manufacturing Method of Printed Circuit Board for LED Lighting | Patent No. 10-1536200 |
Certification Status
| Certification Date | Certification Contents | Certification authority |
|---|---|---|
| 2006.08 | UL Certification (E102784) | UL |
| 2005. 03 | Samsung Eco-Partner | Samsung Electronics |
| 2005. 04 | ISO 14001 | SMC |
| 2005. 10 | LG eco | LG Electronics |
| 2006. 01 | SQ-MARK | Hyundai Motor Company and Kia Motors Corporation |
| 2010. 01 | INNOBiz | Ministry of SMEs and Startups |
| 2019. 06 | IATF 16949 | KSA |